SAN JOSE, Calif. -- Next-generation 450-mm fabs could become a reality, but not in the timeframe that some had hoped. As reported, Intel, TSMC and Samsung are separately pushing for the advent of 450-mm fabs by 2012 or so. Some believe 450-mm fabs will never happen, saying the R&D costs are too expensive. If or when 450-mm appears, the first production fabs could emerge at the 8- or 5-nm nodes, somewhere between the 2017 to 2019 timeframe, said Dean Freeman, an analyst with Gartner Inc. And in total, it could cost a staggering $20-to-$40 billion to bring the next-generation wafer size to the market, Freeman said. The price for a 450-mm toolset: $100 million! But will 450-mm become a reality? Right now, it's a toss-up and it doesn't make sense, given the current economy. 450-mm will become a reality when the economics dictate...
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