Fujitsu Microelectronics, e-Shuttle and D2S to Develop Maskless ICs

Industry leaders introduce design for e-beam technology to deliver significant cost and time reductions for producing prototypes, derivatives and high-value ICs TOKYO and SAN JOSE, Calif., Oct. 8 /PRNewswire/ -- Fujitsu Microelectronics Limited ("FML"), e-Shuttle, Inc.("e-Shuttle") -- a joint venture established by FML and Advantest Corporation ("Advantest") -- and D2S, an emerging design and software company, today announced an agreement under which FML and e-Shuttle will adopt D2S' advanced design for e-beam (DFEB)* technology-starting with a 65-nm Low Power (LP) library-to result in the creation of test silicon to refine and validate DFEB technology for the 65-nm, 40-nm and below nodes. e-Shuttle will produce test chips using D2S' advanced DFEB design and software capabilities, and FML's standard cell libraries. These test... [read full story]