SCOTTS VALLEY, Calif.—(BUSINESS WIRE)—July 15, 2008— Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq:NDSN) and leader in dispensing, coating and jetting technologies, as a “Partner in Innovation.” Asymtek’s Axiom® automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI’s 3D vertical interconnect process. Vertical Circuits’ patented vertical interconnect pillar (VIPTM) technology provides a low-cost alternative to existing wire bond and emerging through silicon via (TSV) interconnect solutions. The VIPTM solution enables IC manufacturers to deliver cost-effective stacked semiconductor die solutions that maximize the silicon density and minimize the package...
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