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Winbond, Qimonda team up on next-gen DRAM

eetasia.com
Apr 23, 2008
        
Story Timeline:  173 days

Qimonda this week said that it has signed a technology license and foundry agreement for its new 65nm 'buried wordline' technology with Taiwan's Winbond Electronics. ... venture in Taiwan dead in the water? Germany's Qimonda AG this week said that it has signed a... [read full story]                    

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Qimonda and Elpida announce technology partnership

 dvhardware.net Apr 25, 2008
First article on this story:

Winbond and Qimonda announce new agreement for 65nm buried wordline technology transfer

 digitimes.com Apr 22, 2008
Selected publications with coverage of this story:
finanztreff.de eetasia.com edn.com dvhardware.net rss-nachrichten.de ad-hoc-news.de tmcnet.com digitalmediaasia.com digitimes.com
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Qimonda and Elpida announce technology partnership

dvhardware.net
Apr 25, 2008
        

Qimonda AG (NYSE:QI) and Elpida Memory, Inc. (Tokyo SE: 6665), both leading global memory suppliers, today announced that they have signed a Memorandum of Understanding for a technology partnership on joint development of memory chips (DRAMs). In the planned cooperation, Qimonda will provide its...

                   
tmcnet.com: Welcome to TMCnet.com tmcnet.com

Qimonda and Elpida to Jointly Develop Memory Chips

tmcnet.com
Apr 24, 2008
        

Global memory suppliers Qimonda and Elpida Memory, have entered into a technology partnership to jointly develop memory chips (DRAMs). While developing the memory chips, Qimonda will provide its expertise with the innovative Buried Wordline technology and Elpida will offer its advanced stack...

Qimonda, Elpida to form technology partnership

digitalmediaasia.com
Apr 24, 2008
        

Qimonda will provide its know-how with the Buried Wordline technology and Elpida its stack capacitor technology. ... The strategic technology cooperation is expected to leverage the strength of both companies to accelerate their roadmap to DRAM products featuring cell...

DRAM partnering trend continues with Qimonda, Elpida joint development agreement

edn.com
Apr 24, 2008
        

Qimonda and Elpida Memory plan a DRAM partnership that will see the two memory makers jointly develop technology platforms and design rules to allow exchange of products and potential manufacturing joint ventures. The collaboration comes as Infineon continues with plans to sell off its stake in...

DJ DGAP-Adhoc: Qimonda and Elpida to Form Technology Partnership

rss-nachrichten.de
Apr 24, 2008
        

Infineon Technologies AG / Miscellaneous 24.04.2008 Release of an Ad hoc announcement according to § 15 WpHG, transmitted by DGAP - a company of EquityStory AG. ... Infineon Technologies AG / Miscellaneous Release of an Ad hoc announcement according to § 15 WpHG,...

                   

DGAP-Adhoc: Qimonda and Elpida to Form Technology Partnership

finanztreff.de
Apr 24, 2008
        

Infineon Technologies AG / Miscellaneous 24.04.2008 Release of an Ad hoc announcement according to § 15 WpHG, transmitted by DGAP - a company of EquityStory AG. The issuer is solely responsible for the content of this announcement. The Infineon subs ... Infineon...

DGAP-Adhoc: Qimonda and Elpida to Form Technology Partnership

ad-hoc-news.de
Apr 24, 2008
        

Infineon Technologies AG / Miscellaneous 24.04.2008 Release of an Ad hoc announcement according to § 15 WpHG, transmitted by DGAP - a company of EquityStory AG. The issuer is solely responsible for the content of this announcementThe Infineon subsidiary Qimonda AG releases the following press...

Winbond and Qimonda announce new agreement for 65nm buried wordline technology transfer

digitimes.com
Apr 22, 2008
        

Winbond Electronics and Qimonda on April 22 announced a new agreement for 65nm buried wordline DRAM technology transfer. ... The agreement, referring to a new DRAM technology roadmap unveiled by Qimonda, will replace the existing contract of 58nm DRAM trench technology...