November 03, 2009 06:05 AM US Eastern Timezone Cost Efficiency from Smaller TSV Footprint Significantly Expands Economic Advantages of AquiVia’s Low Cost of Ownership for 3D Devices MASSY, France-- --Alchimer S.A., leading... [read full story]
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Cost Efficiency Expands Economic Advantages of AquiVia's Low Cost of Ownership for 3D Devices Alchimer S.A. , leading provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D...
MASSY, France - Alchimer S.A., leading provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV), has demonstrated that TSVs with aspect ratios of...
